PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board where the number of layers and a plate thickness are increased in accordance with high wiring density of the printed wiring board, and which is mountable to the conventional rail groove width of a casing etc. as it is, and made light weight and...

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1. Verfasser: MUKOUYAMA NARUHIDE
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a printed wiring board where the number of layers and a plate thickness are increased in accordance with high wiring density of the printed wiring board, and which is mountable to the conventional rail groove width of a casing etc. as it is, and made light weight and also stably mountable to the rail. SOLUTION: In the printed wiring board, there is performed a plate thickness adjustment where the plate end of a contact surface with the rail at both ends of the printed wiring board in contact with the rail of the casing is cut such that positions of a remaining part are made an upper and lower zigzag structure and the plate end is subjected to counterbore processing in accordance with the rail groove width, and that four corners and a plate end corner of the remaining part after cutting are processed into a slanting structure. COPYRIGHT: (C)2006,JPO&NCIPI