DIE FOR PROCESSING BASE BOARD, MANUFACTURING METHOD OF PROCESSING PLATE AND MANUFACTURING METHOD OF PRODUCT PLATE

PROBLEM TO BE SOLVED: To restrain breakage of a base board, and lowering of strength and life of a die in the case of manufacturing a processing plate including a plurality of product plates relatively opposite to each other at shorter intervals through a relatively long straight line part by push-back processing. SOLUTION: In a push-back area 3, the base board 10 is fed step by step to perform push-back processing for the base board 10, thereby forming two printed circuit boards 14a, 14b arranged side by side along the transport direction of the base board 10. Subsequently, the base board 10 is transported to locate the printed circuit boards 14a, 14b on the outline cutting area 5, and simultaneously with picking a mounting board 18 and cutting a frame part, push-back processing for the printed circuit board 14c is performed in the push-back area. Further, the base board 10 is moved backward to perform push-back processing for an unprocessed part located on the downstream side of the printed circuit board 14c in the push-back area 3, thereby forming a printed circuit board 14d. COPYRIGHT: (C)2006,JPO&NCIPI