ULTRASONIC MOUNTING TOOL AND MOUNTING APPARATUS FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an ultrasonic mounting tool capable of mounting a bracket without bringing the power loss of ultrasonic vibrations induced on the horn. SOLUTION: The tool comprises a transducer 23 connected to one end of a horn 22 for vibrating the horn; an ultrasonic tool unit 25 f...

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Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO MASANORI, HERAI MASAYASU, UEHARA SADATO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an ultrasonic mounting tool capable of mounting a bracket without bringing the power loss of ultrasonic vibrations induced on the horn. SOLUTION: The tool comprises a transducer 23 connected to one end of a horn 22 for vibrating the horn; an ultrasonic tool unit 25 for holding a semiconductor chip provided on an underside where the vibration is maximum; a load support 26 projected at a corresponding position to the tool on the upside of the horn; a bracket 27 which butts a lengthwise middle of the underside to the load support and connects and fixes the lengthwise ends, to a portion where the vibration is minimum to transmit the load to the tool unit through the load support when pressing the semiconductor chip; and a hollow 29 disposed in portions between the ends of the bracket and the middle butted to the load support having each a lower rigidity than other portions, enough to be bent and deformed to block the part butted to the load support of the bracket from being bent and deformed when the ends of the bracket are connected and fixed to the horn. COPYRIGHT: (C)2006,JPO&NCIPI