STRUCTURE FOR CONNECTING SEMICONDUCTOR ELEMENT, WIRING BOARD, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a high-reliability semiconductor device by avoiding disadvantageous contact between a semiconductor element and a wiring pattern, when connecting connection terminals of the semiconductor element to the wiring of a wiring board. SOLUTION: A structure for connecting a semiconductor element 11 is used to electrically connect bump electrodes 12, provided to the semiconductor element 11 to connection terminals 31 of a wiring pattern 3, provided to a flexible wiring board 1. The flexible wiring board 1 has a solder resist covered portion, where the wiring pattern 3 is covered with a solder resist 41, and solder resist openings 42 which expose the connection terminals 31. The solder resist openings 42 are provided so as to surround at least a part of the solder resist covered portion. COPYRIGHT: (C)2006,JPO&NCIPI