METHOD FOR CONNECTING COF

PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a h...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NAKAMINAMI HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	NAKAMINAMI HIROAKI
description	PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a heat crimping step to pinch a buffer material 13 between the COF 2 and a heating head 10, and to press it while heating it by the heating head 10. The heat crimping step includes a step for crimping while pressing down the heating head 10 by downward thrust force obtained from the following formula. Formula is expressed as follows: (Downward thrust force)=(Width of COF)×(Crimping length of COF)×(Pressure required for crimping)×(Number of COFs)+(Total length of board space)×(Crimping length of COF)×(Pressure required for crimping)×(Conversion factor). COPYRIGHT: (C)2006,JPO&NCIPI
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006147766A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006147766A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006147766A3</originalsourceid><addsrcrecordid>eNrjZJD0dQ3x8HdRcPMPUnD29_NzdQ7x9HMHMt14GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgYGZoYm5uZmZozFRigBAgiBK</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR CONNECTING COF</title><source>esp@cenet</source><creator>NAKAMINAMI HIROAKI</creator><creatorcontrib>NAKAMINAMI HIROAKI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a heat crimping step to pinch a buffer material 13 between the COF 2 and a heating head 10, and to press it while heating it by the heating head 10. The heat crimping step includes a step for crimping while pressing down the heating head 10 by downward thrust force obtained from the following formula. Formula is expressed as follows: (Downward thrust force)=(Width of COF)×(Crimping length of COF)×(Pressure required for crimping)×(Number of COFs)+(Total length of board space)×(Crimping length of COF)×(Pressure required for crimping)×(Conversion factor). COPYRIGHT: (C)2006,JPO&NCIPI</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060608&DB=EPODOC&CC=JP&NR=2006147766A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060608&DB=EPODOC&CC=JP&NR=2006147766A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAMINAMI HIROAKI</creatorcontrib><title>METHOD FOR CONNECTING COF</title><description>PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a heat crimping step to pinch a buffer material 13 between the COF 2 and a heating head 10, and to press it while heating it by the heating head 10. The heat crimping step includes a step for crimping while pressing down the heating head 10 by downward thrust force obtained from the following formula. Formula is expressed as follows: (Downward thrust force)=(Width of COF)×(Crimping length of COF)×(Pressure required for crimping)×(Number of COFs)+(Total length of board space)×(Crimping length of COF)×(Pressure required for crimping)×(Conversion factor). COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD0dQ3x8HdRcPMPUnD29_NzdQ7x9HMHMt14GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8V4CRgYGZoYm5uZmZozFRigBAgiBK</recordid><startdate>20060608</startdate><enddate>20060608</enddate><creator>NAKAMINAMI HIROAKI</creator><scope>EVB</scope></search><sort><creationdate>20060608</creationdate><title>METHOD FOR CONNECTING COF</title><author>NAKAMINAMI HIROAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006147766A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAMINAMI HIROAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAMINAMI HIROAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR CONNECTING COF</title><date>2006-06-08</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a heat crimping step to pinch a buffer material 13 between the COF 2 and a heating head 10, and to press it while heating it by the heating head 10. The heat crimping step includes a step for crimping while pressing down the heating head 10 by downward thrust force obtained from the following formula. Formula is expressed as follows: (Downward thrust force)=(Width of COF)×(Crimping length of COF)×(Pressure required for crimping)×(Number of COFs)+(Total length of board space)×(Crimping length of COF)×(Pressure required for crimping)×(Conversion factor). COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_JP2006147766A
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	METHOD FOR CONNECTING COF
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T03%3A04%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAMINAMI%20HIROAKI&rft.date=2006-06-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2006147766A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true