METHOD FOR CONNECTING COF

PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a h...

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Bibliographische Detailangaben
1. Verfasser:	NAKAMINAMI HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for connecting a COF by which the COF can be fitted efficiently and surely. SOLUTION: The method for connecting a COF 2 includes a step to fit the COF 2 to a liquid crystal panel 1 by means of an anisotropical conductive film 3. The fitting step includes a heat crimping step to pinch a buffer material 13 between the COF 2 and a heating head 10, and to press it while heating it by the heating head 10. The heat crimping step includes a step for crimping while pressing down the heating head 10 by downward thrust force obtained from the following formula. Formula is expressed as follows: (Downward thrust force)=(Width of COF)×(Crimping length of COF)×(Pressure required for crimping)×(Number of COFs)+(Total length of board space)×(Crimping length of COF)×(Pressure required for crimping)×(Conversion factor). COPYRIGHT: (C)2006,JPO&NCIPI