PIPE HEATING STRUCTURE

PROBLEM TO BE SOLVED: To heat evenly a pipe with regard to a pipe heating structure in a semiconductor manufacturing equipment, the other manufacturing equipment or a chemical reaction processing equipment or the like. SOLUTION: An inside wall of a heat-retaining jacket 10 comprising a heat insulati...

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Bibliographische Detailangaben
Hauptverfasser: NOMOTO TSUGUHIRO, HASEGAWA TEIJI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To heat evenly a pipe with regard to a pipe heating structure in a semiconductor manufacturing equipment, the other manufacturing equipment or a chemical reaction processing equipment or the like. SOLUTION: An inside wall of a heat-retaining jacket 10 comprising a heat insulation member 11 is made to abut, in its polygonal state in a cross section perpendicular to a longitudinal direction of the pipe 1, against an outer peripheral wall surface of the pipe 1 having a circular cross section. Thus, the pipe 1 is covered with the heat-retaining jacket 10 with air intervened in a space 13 between corners 12 of the polygon and the pipe 1 to arrange an electrically-heating wire 14 at the corners 12 so that the wire extends in the longitudinal direction. COPYRIGHT: (C)2006,JPO&NCIPI