SUBSTRATE MATERIAL FOR HEAT-RESISTANT ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide a substrate material for heat-resistant adhesive tape, low in hygroscopicity and excellent in thickness accuracy, interlaminar releasability and electrical insulation. SOLUTION: The substrate material for heat-resistant adhesive tape consists of a nonwoven fabric com...

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Bibliographische Detailangaben
Hauptverfasser:	MIYAGUCHI YUTAKA, NISHIOMOTE KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BRAIDING CHEMISTRY COTTON-WOOL DYES FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS KNITTING LACE-MAKING MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL NON-WOVEN FABRICS PAINTS POLISHES TEXTILES TRIMMINGS USE OF MATERIALS AS ADHESIVES WADDING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a substrate material for heat-resistant adhesive tape, low in hygroscopicity and excellent in thickness accuracy, interlaminar releasability and electrical insulation. SOLUTION: The substrate material for heat-resistant adhesive tape consists of a nonwoven fabric comprising wholly aromatic polyester fiber. The nonwoven fabric has a moisture absorption of 0.1% or less at 25°C and 90% RH, a density of 0.1-1.3 g/cm3and a thickness accuracy of A±0.1A(μm) ( wherein A is the average thickness(μm) of the nonwoven fabric ). COPYRIGHT: (C)2006,JPO&NCIPI