SUBSTRATE PROCESSING EQUIPMENT

PROBLEM TO BE SOLVED: To enhance throughput of a batch type CVD system sufficiently. SOLUTION: In a batch type CVD system comprising a wafer transfer chamber 27 adjacent to a chamber 4 where a boat 24 waits for a processing chamber 11, a pot opener 40 for opening/closing a pod P carrying a wafer W, and a wafer transfer device 30 installed in the wafer transfer chamber 27 in order to transfer the wafer W between a boat 24 and the pod P, a gate valve 29 is interposed between the waiting chamber 4 and the wafer transfer chamber 27, stockers 33A and 33B are installed in the wafer transfer chamber 27, a shielding plate 34 is installed between the stockers 33A and 33B, and gas supply pipes 35A and 35B are installed in the vicinity of the stockers 33A and 33B. Since a processed wafer carried out from the processing chamber can be cooled forcibly in the wafer transfer chamber, cooling waiting time of the processed wafer can be shortened and since pressure reduction and release of the waiting chamber can be eliminated, throughput can be enhanced. COPYRIGHT: (C)2006,JPO&NCIPI