BENDING METHOD AND BENDING DEVICE

PROBLEM TO BE SOLVED: To provide a bending method and a bending device for saving wastes of a material and reducing the material cost by discovering rejected products and acceptable products early enough, shortening the inspection time by omitting inspection steps after working, shortening the time...

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1. Verfasser: IKEDA HIDEKATSU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bending method and a bending device for saving wastes of a material and reducing the material cost by discovering rejected products and acceptable products early enough, shortening the inspection time by omitting inspection steps after working, shortening the time of delivery of the acceptable products, and improving total working efficiency. SOLUTION: When a touch checking sensor provided on a back gage butting part is turned ON when the back gage butting part is retracted after a workpiece is positioned and a punch is brought into contact with the workpiece, a rejection signal to inform production of a rejected product caused by the positional deviation of the workpiece is outputted. When the touch checking sensor is turned OFF, an acceptance signal to inform generation of an acceptable product is outputted. COPYRIGHT: (C)2006,JPO&NCIPI