METHOD FOR MANUFACTURING MULTILAYER BOARD

PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer board which can realize a small quantity large variety production, without reducing productive efficiency, such as a product filling factor of press, an increase of press frequency, by solving the problem concerning the qualit...

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Bibliographische Detailangaben
1. Verfasser:	TAKAMATSU SHOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide the manufacturing method of a multilayer board which can realize a small quantity large variety production, without reducing productive efficiency, such as a product filling factor of press, an increase of press frequency, by solving the problem concerning the quality that is caused due to pressure after the set pressure conditions for each size have been unified. SOLUTION: The method is used to combine an internal layer circuit board, a prepreg, and a metallic foil or an outer layer material; to stack them in multiple layers; and a manufacture a multilayer board. A dummy board is additionally arranged in the same plane during pressing, product pressure is adjusted, and then two or more kinds of multilayer boards with different sizes are stacked in a multilayer manner in one-time operation. COPYRIGHT: (C)2006,JPO&NCIPI