SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device in which a wire connected to a semiconductor chip by the side of a lower stage is hard to be deformed, and which can be constituted in a thin shape in relation to the semiconductor device in which a plurality of semiconductor chips are laminated and arranged, and to provide a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device includes a first semiconductor chip 14 carried on a substrate 12, a second semiconductor chip 16 laminated and arranged on the first semiconductor chip 14, and wires 26 and 28 for electrically connecting the first and second semiconductor chips to the substrate 12. The second semiconductor chip 16 includes a first adhesive layer 38 and a second adhesive layer 40. A fine concave-convex structure 42 is fixed to the first semiconductor chip 14 by an insulating adhesive layer 36 formed uniformly in the interface, and at least the part of the first wire 26 is intruded into the first adhesive layer 38 of the insulating adhesive layer 36. COPYRIGHT: (C)2006,JPO&NCIPI