CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide the manufacturing method of a circuit board which hardly generates defects and a circuit board using it which is excellent in heat dissipation property, and has high junction strength and is excellent in junction reliability. SOLUTION: An adhesive 3 which comprises metallic fine particle having an average particle diameter of 1 to 100 nm and at least one kind of active metal selected from Ti, Zr, Hf and Nb is interposed between an insulating substrate 1 and a metallic plate 5. The method has a junction process for joining the insulating substrate 1 and the metallic plate 5 by heating a lamination body to a junction temperature less than a melting point of the metallic fine particle. COPYRIGHT: (C)2006,JPO&NCIPI