SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To cause as less cracks as possible in a solder layer due to a temperature cycle in a semiconductor device which is such that a semiconductor element is bonded on a metal body by solder and then is sealed by a molding resin. SOLUTION: The semiconductor device 100 comprises the metal body 10, the semiconductor element 20 mounted on one face of the metal body 10, the solder layer 30 which exists between the metal body 10 and the semiconductor element 20 to bond these together, and a first resin 40 which seals the metal body 10 and the semiconductor element 20 as if wrapping around them. In the periphery of the solder layer 30, a second resin 70 formed of epoxy resin, etc. which has a coefficient of thermal expansion closer to that of the solder layer 30 than to that of the first resin 40 is formed along the entire circumference of the solder layer 30 in contact with an end of it. COPYRIGHT: (C)2006,JPO&NCIPI