EXCESS-METAL-LAYER REMOVING METHOD

PROBLEM TO BE SOLVED: To provide an excess-metal-layer removing method whereby there can be obtained a polished surface whereon the generations of scratches and corrosion are reduced especially in a damascene method. SOLUTION: The excess-metal-layer removing method is such a method that, when manufa...

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Bibliographische Detailangaben
Hauptverfasser: HATTORI MASAYUKI, KAWAHASHI NOBUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an excess-metal-layer removing method whereby there can be obtained a polished surface whereon the generations of scratches and corrosion are reduced especially in a damascene method. SOLUTION: The excess-metal-layer removing method is such a method that, when manufacturing a wiring substrate comprising a base material having grooves and a metal material buried in the grooves which forms metal wiring portions, there is removed an excess metal layer formed on the surface of the wiring substrate which has the metal wiring portions. The excess-metal-layer removing method has a process for subjecting the excess metal layer to a chemical mechanical polishing while feeding to the layer a water-based dispersing element (I) for the chemical mechanical polishing which contains abrasive grains, and has a process for cleaning thereafter the polished layer while feeding to it an aqueous solution (II) for a non-chemical mechanical polishing which contains hydrogen peroxide of 0.001-10 mass%. COPYRIGHT: (C)2006,JPO&NCIPI