METHOD FOR PLATING SMALL ELECTRONIC COMPONENT

METHOD FOR PLATING SMALL ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method for plating a small electronic component, which does not lower plating rate even in the case of a small electronic component, facilitates the control of media size and suppresses disadvantageous incident caused by reducing media size. SOLUTION: The method co...

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Bibliographische Detailangaben
Hauptverfasser: AIBA TAKASHI, ABE YUKIMARE, KUME HISASHI, KONNO MASAHIKO
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for plating a small electronic component, which does not lower plating rate even in the case of a small electronic component, facilitates the control of media size and suppresses disadvantageous incident caused by reducing media size. SOLUTION: The method comprises placing a workpiece and spherical media in a barrel, immersing the barrel in a plating solution, and plating the workpiece by the stir of the workpiece and the media by rotating the barrel and the application of a voltage through the plating solution. When the media used is spherical media having a diameter larger than the longitudinal size of the workpiece, the plating rate is not lowered, and disadvantageous incident caused by reducing media size can be avoided. COPYRIGHT: (C)2006,JPO&NCIPI