MANUFACTURING METHOD FOR ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To reduce the cost of a high-frequency power amplifier by mounting an air-core coil on a wiring board without using a bulk feeder after forming the air-core coil. SOLUTION: A manufacturing method is provided for an electronic device having a power amplifier. The method includes...

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Bibliographische Detailangaben
Hauptverfasser:	SATO SUSUMU, KOZU TADASHI, TSUKADA KATSUHIKO, KOBAYASHI YOSHIHIKO, ISHIZU AKIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce the cost of a high-frequency power amplifier by mounting an air-core coil on a wiring board without using a bulk feeder after forming the air-core coil. SOLUTION: A manufacturing method is provided for an electronic device having a power amplifier. The method includes a process (a) of winding a wire rod around a winding jig to form a helical portion, a process (b) of cutting a part of the wiring rod to separate the helical portion away from the wiring rod, a process (c) of pulling the winding jig out of the helical portion to form the air-core coil, and a process (d) of mounting the air-core coil on the wiring board after the process (c). Consequently, the manufacturing method prevents a plurality of air-core coils from being entangled in an entangled state during the processes (c) and (d). COPYRIGHT: (C)2006,JPO&NCIPI