METHOD OF MANUFACTURING MULTILAYERED CERAMIC SUBSTRATE
PROBLEM TO BE SOLVED: To provide a method of manufacturing multilayered ceramic substrate by which the occurrence of defective insulation between layers can be prevented. SOLUTION: The method of manufacturing multilayered ceramic substrate includes a step of forming a via hole in each green sheet an...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of manufacturing multilayered ceramic substrate by which the occurrence of defective insulation between layers can be prevented. SOLUTION: The method of manufacturing multilayered ceramic substrate includes a step of forming a via hole in each green sheet and packing conductor paste into the hole; a step of forming circuit wiring patterns on the surfaces of the produced green sheets; and a step of applying insulating paste on the circuit wiring patterns above the portions in which the upper parts of the via holes are bonded to the circuit wiring patterns, and/or to the portions below the via holes of the green sheets laminated immediately under the green sheets, to the circuit wiring patterns of which the lower parts of the via holes are bonded. The method also includes a step of forming a laminate by laminating these plurality green sheets upon another and contraction suppressing sheets, which are not sintered at the baking temperature of the green sheets, upon the top and bottom of the laminated green sheets after the step of applying the insulating paste; and a fifth step of baking the laminate and removing the contraction suppressing sheets from the baked laminate. COPYRIGHT: (C)2006,JPO&NCIPI |
---|