MOUNTING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD WITH REINFORCING PLATE AND IC PACKAGE

PROBLEM TO BE SOLVED: To reduce soldering failure due to warping of an FPC with a reinforcing plate generated at the time of soldering, in a mounting method of jointing a mounting pattern formed at the FPC and a terminal formed at an IC package. SOLUTION: In the mounting method of jointing a mountin...

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Bibliographische Detailangaben
1. Verfasser:	IDE SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CURRENT COLLECTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce soldering failure due to warping of an FPC with a reinforcing plate generated at the time of soldering, in a mounting method of jointing a mounting pattern formed at the FPC and a terminal formed at an IC package. SOLUTION: In the mounting method of jointing a mounting pattern formed at the FPC and a terminal formed at an IC package, soldering is carried out after forming reverse warping corresponding to the warping of FPC with the reinforcing plate generated at the time of soldering. COPYRIGHT: (C)2006,JPO&NCIPI