SURFACE TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To provide a surface treatment apparatus for continuously treating the surface of a film, which prevents an impurity gas from diffusing into and contaminating a surface treatment chamber, without being affected by a difference between the pressures of the surface treatment room...

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Bibliographische Detailangaben
1. Verfasser:	NAMIKI SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a surface treatment apparatus for continuously treating the surface of a film, which prevents an impurity gas from diffusing into and contaminating a surface treatment chamber, without being affected by a difference between the pressures of the surface treatment rooms, and miniaturizes the apparatus. SOLUTION: This surface treatment apparatus has a roll room and a surface treatment room in a chamber, which are partitioned by a seal roller and a sealing mechanism section that is arranged closely to those rooms without contacting them; and has an opening between the seal roller and the sealing mechanism section. The sealing mechanism has a gas supply section for supplying a gas to the opening, and a gas exhaust outlet for exhausting the gas from the opening. COPYRIGHT: (C)2006,JPO&NCIPI