BALL INSPECTING METHOD IN WIRE BONDING
PROBLEM TO BE SOLVED: To provide a ball inspecting method in wire bonding which accurately inspects the bonded condition of a ball through image processing, by using coaxial light parallel to the lens optical axis of an imaging means as illumination light for illumination of a pad and the ball, and...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a ball inspecting method in wire bonding which accurately inspects the bonded condition of a ball through image processing, by using coaxial light parallel to the lens optical axis of an imaging means as illumination light for illumination of a pad and the ball, and by changing the color of the coaxial light to an optimum color according to inspection contents. SOLUTION: In the ball inspecting method for inspecting the bonded condition of a ball 5 in wire bonding for wiring between a pad 3 and an external electrode in a semiconductor chip 1, a part including the pad 3 and the ball 5 is imaged by an imaging means 12, and the bonded condition of the ball 5 is detected by image processing on the basis of a planar image taken by the imaging means. Coaxial light parallel to the optical axis of the lens 13 of the imaging means 12 as illumination light for illumination of the part of the pad 3 and the ball 5 is used, and the color of the coaxial light is changed according to inspected contents. COPYRIGHT: (C)2006,JPO&NCIPI |
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