SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a wafer level CSP (chip size package) which prevents malfunction caused by light and is made also applicable to a mounting form without shading. SOLUTION: A semiconductor device and a manufacturing method therefor are provided. The semiconductor device comprises a chip-like board 21, a first resin 28a formed on one surface of the board 21, a wiring structure (22-27) which is formed on the other surface of the board 21 and has a plurality of copper posts 27 projecting in opposite to the board 21 on the outermost side of the structure, a second resin 28b which is so formed as to reach the first resin 28a to seal the wiring structure (22-27) and the board 21 while allowing the top face of each copper post 27 to expose, a plurality of solder terminals 29 each formed on the top face of each copper post 27, and side faces which are formed by cutting the first and second resins 28a, 28b along the periphery of the board 21 so as not to expose the board 21. The board 21 is sealed completely with respective resins 28a, 28b. COPYRIGHT: (C)2006,JPO&NCIPI