WIRING BOARD FOR LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING THE SAME AND LIGHT EMITTING ELEMENT

PROBLEM TO BE SOLVED: To provide a wiring board for a light emitting element which is superior in heat dissipation, its manufacturing method and a light emitting device. SOLUTION: The wiring board for a light emitting element is provided with an insulting substrate 1 made of ceramics, conductor layers 3, 5 and 7 which are formed at least on/in either of the surface or the inside of the insulating substrate 1 through simultaneous baking together with the insulating substrate 1 and contains copper of 10-70 vol% and at least one kind selected from tungsten and molybdenum at 30-90 vol% and wherein one kind selected from tungsten and molybdenum is dispersed as particles in a matrix made of copper, and a mounting part 9 wherein the light emitting element is mounted to one main surface of the insulating substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI