SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To equalize the length of respective wires when two joints are connected through a plurality of wires. SOLUTION: The semiconductor module comprises: a modular substrate having an interconnect line including a wire joint and an external electrode terminal; a semiconductor chip secured to the upper surface side of the substrate and having an electrode on the upper surface; and a conductive wire for connecting the electrode of the semiconductor chip with the wire joint. Predetermined electrode and predetermined wire joint of the semiconductor chip are arranged in parallel in elongated profile, predetermined electrode and predetermined wire joint are connected through a plurality of wires of the same length, and the short side of any one of predetermined electrode or predetermined wire joint has a width corresponding to several times of wire joint area required for connecting each wire even if the securing position of the semiconductor chip is shifted. COPYRIGHT: (C)2006,JPO&NCIPI