METHOD OF MANUFACTURING COVER GLASS FOR SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a cover glass for a semiconductor package by which the surface is easily polished and the increase of α-ray emission caused by the sticking of abrasive containing U or Th on the surface is prevented. SOLUTION: A glass chip having ≤0.01 c/cm2...

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Bibliographische Detailangaben
Hauptverfasser:	SANBE SHUJI, YODOGAWA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a cover glass for a semiconductor package by which the surface is easily polished and the increase of α-ray emission caused by the sticking of abrasive containing U or Th on the surface is prevented. SOLUTION: A glass chip having ≤0.01 c/cm2×hr α-ray emission is manufactured by polishing the surface of large-sized glass, removing the peripheral part thereof and chipping the inside part. COPYRIGHT: (C)2006,JPO&NCIPI