METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component having high dimension precision by a rational method suitable for mass production with less waste. SOLUTION: This method for manufacturing an electronic component is provided by placing constraint green sheets 2 whic...

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1. Verfasser: TAKEO AKIRA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component having high dimension precision by a rational method suitable for mass production with less waste. SOLUTION: This method for manufacturing an electronic component is provided by placing constraint green sheets 2 which do not substantially contract in the burning temperature of a ceramic green sheet laminate 3 on ceramic floor plates 1, and by burning the ceramic green sheet laminate 3 in the status that the ceramic floor plates 1 are set so that the constraint green sheets 2 can be brought into contact with the upper and lower faces of the ceramic green sheet laminate 3, and then separating the ceramic burnt body as an electronic component from the ceramic floor plates. The constraint green sheets 2 contain melting components which are put in a melting status when the burning temperature increases. COPYRIGHT: (C)2006,JPO&NCIPI