SUBSTRATE CRACK INSPECTION METHOD AND SUBSTRATE CRACK INSPECTION DEVICE

PROBLEM TO BE SOLVED: To provide a method capable of highly-reliable substrate crack inspection even in the presence of an external noise. SOLUTION: This substrate crack inspection method is characterized by having a process wherein (1) a vibration is applied to a substrate 1 to generate a sound, (2...

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1. Verfasser: YAGI KATSUYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method capable of highly-reliable substrate crack inspection even in the presence of an external noise. SOLUTION: This substrate crack inspection method is characterized by having a process wherein (1) a vibration is applied to a substrate 1 to generate a sound, (2) at least a generated sound from the substrate 1 is grasped by using the first microphone 5a, and substantially simultaneously the external noise is grasped by using the second microphone 5b, (3) acoustic analysis is performed on the sounds grasped by the first and second microphones 5a, 5b, to thereby determine first and second power spectrums corresponding to each sound, and (4) existence of a substrate crack is determined based on the difference of the spectrum intensity between the first and second power spectrums in a prescribed frequency domain. COPYRIGHT: (C)2006,JPO&NCIPI