MOUNTING METHOD AND MOUNTING DEVICE OF CHIP

PROBLEM TO BE SOLVED: To provide a mounting method in which a warping caused in a board can be removed for mounting chips. SOLUTION: This mounting method for mounting chips to the board comprises the steps of transferring the board for positioning it to a mounting position, supporting one face of th...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAWABE KATSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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