MOUNTING METHOD AND MOUNTING DEVICE OF CHIP

PROBLEM TO BE SOLVED: To provide a mounting method in which a warping caused in a board can be removed for mounting chips. SOLUTION: This mounting method for mounting chips to the board comprises the steps of transferring the board for positioning it to a mounting position, supporting one face of th...

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Bibliographische Detailangaben
1. Verfasser:	KAWABE KATSUYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting method in which a warping caused in a board can be removed for mounting chips. SOLUTION: This mounting method for mounting chips to the board comprises the steps of transferring the board for positioning it to a mounting position, supporting one face of the board positioned to the mounting position by a mounting stage 6, mounting a chip 14 by a mounting tool 27 on the other face of the board with the one face being supported by the mounting stage, and pressurizing the board by the mounting tool for chucking it to the mounting stage before the chips are mounted to the board by the mounting tool. COPYRIGHT: (C)2006,JPO&NCIPI