METHOD OF MANUFACTURING PRINTED WIRING BOARD INCORPORATING RESISTOR

PROBLEM TO BE SOLVED: To provide a method by which a printed wiring board having a resistor which is higher in accuracy and resistance than the conventional method can be manufactured. SOLUTION: In the method of manufacturing the printed wiring board incorporating a resistor, a resistance layer 2, a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MIZUNO YUKA
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method by which a printed wiring board having a resistor which is higher in accuracy and resistance than the conventional method can be manufactured. SOLUTION: In the method of manufacturing the printed wiring board incorporating a resistor, a resistance layer 2, a protective layer 3, and a wiring layer 4 are successively formed on an insulating substrate 1; and an etching resist 5 is formed on the wiring layer 4. Then a wiring pattern 6 is formed by etching the layers 4, 3 and 2 and removing the resist 5; and the underlying protective layer 3 is exposed by etching the wiring pattern 6 and removing an etching resist on the pattern 6. After the etching resist formed on the wiring pattern 6 is removed, the resistor 7 is formed by roughening the surface of the wiring layer 4 and etching the exposed protective layer 3. Thereafter, an insulting layer 8 is formed on the resistance layer 2 and the resistor is conducted by forming a via hole. At the same time, a wiring layer 9 is formed on the insulating layer 8 and the wiring layer 9 is patterned. COPYRIGHT: (C)2006,JPO&NCIPI