DEVICE AND METHOD OF BONDING THIN FILM-FORMED BOARD
PROBLEM TO BE SOLVED: To provide a bonding device and a method, wherein thin film-formed substrates can be accurately bonded together with an ultrathin adhesive layer 10 μm or less in thickness with high productivity and high yield at a low cost without producing any air bubbles or voids. SOLUTION:...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a bonding device and a method, wherein thin film-formed substrates can be accurately bonded together with an ultrathin adhesive layer 10 μm or less in thickness with high productivity and high yield at a low cost without producing any air bubbles or voids. SOLUTION: Two or more thin film-formed substrates are bonded together with the adhesive layer through a process, and the inexpensive bonding device equipped with a pressurizing contactor that performs pressurization drawing a spiral pressurizing pattern, without producing any air bubbles or voids. COPYRIGHT: (C)2006,JPO&NCIPI |
|---|