INTERPOSER-MOUNTING METHOD AND INTERPOSER-MOUNTED SHEET

PROBLEM TO BE SOLVED: To provide an interposer-mounting method which can mount an interposer on an antenna-formed sheet without using adhesives, surely prevent a mounted interposer from exfoliating from an antenna-formed sheet, and surely electrically connect the extended electrode of an interposer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKATA HIDETO, SHIMOMURA KIICHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an interposer-mounting method which can mount an interposer on an antenna-formed sheet without using adhesives, surely prevent a mounted interposer from exfoliating from an antenna-formed sheet, and surely electrically connect the extended electrode of an interposer to the antenna of an antenna-formed sheet, and also provide an interposer-mounted sheet obtained by the interposer-mounting method. SOLUTION: The interposer 10 having a first nonconductive layer 11, an extended electrode 12 and an IC chip 13 is mounted on an antenna-formed sheet 20 having a second nonconductive layer 21 and an antenna 22. The interposer 10 is bound with the antenna-formed sheet 20 with a stapler 30 using metallic staple needles 35. At that time, the extended electrode 12 is electrically connected to the antenna 22 by the metallic stapler needles 35. COPYRIGHT: (C)2006,JPO&NCIPI