SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To efficiently radiate the heat generated in a semiconductor device along with achieving reduction in cost, enhancement in reliability, narrow pitch formation and reduction in size, with respect to a semiconductor device having a radiating member for radiating the heat generate...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To efficiently radiate the heat generated in a semiconductor device along with achieving reduction in cost, enhancement in reliability, narrow pitch formation and reduction in size, with respect to a semiconductor device having a radiating member for radiating the heat generated by the semiconductor device. SOLUTION: The semiconductor is provided with a semiconductor device 1; a circuit board 4 electrically connected with this semiconductor device 1; a radiating member 6 which it is fixed to the whole surface of this circuit board 4, and is thermally connected with semiconductor device 1; and an interposer 5A electrically connected with the circuit board 4 while being allocated in the allocation side of the radiating member 6 of a circuit board 4 on the surface of the opposite side. It comprises openings 25 and 26 at the circuit board 4 and the interposer 5A. It is constituted that the semiconductor device 1 is connected to the radiating member 6 thermally directly via these openings 25 and 26. COPYRIGHT: (C)2006,JPO&NCIPI |
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