DEVICE AND METHOD FOR MOUNTING ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a method for mounting by which a chip held by a mounting tool can be easily and surely positioned by a gauge. SOLUTION: The mounting method includes a mounting step, that is, a step to take out a chip 6 by a pick-up tool 11 and reverse it, a step to receive the chip...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAWAI ISAMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!