APPARATUS AND METHOD FOR ELECTROPLATING, ELECTROFORMING AND MANUFACTURING SUBSTRATE OF ELECTROPHOTOGRAPHIC PHOTORECEPTOR, AND SUBSTRATE OF ELECTROPHOTOGRAPHIC PHOTORECEPTOR, ELECTROPHOTOGRAPHIC PHOTORECEPTOR, AND ELECTROPHOTOGRAPHIC DEVICE

PROBLEM TO BE SOLVED: To provide an apparatus for electroplating and electroforming, suitable for manufacturing a seamless flexible endless member for a substrate of an electrophotographic photoreceptor capable of forming an adequate image free from an image defect; a method therefor; a method for m...

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Hauptverfasser: SUZUKI KAZUYA, TAKASHITA YASUHIDE, OKUZAWA MAKOTO, UEDA SHINJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an apparatus for electroplating and electroforming, suitable for manufacturing a seamless flexible endless member for a substrate of an electrophotographic photoreceptor capable of forming an adequate image free from an image defect; a method therefor; a method for manufacturing the substrate of the electrophotographic photoreceptor; the substrate of the electrophotographic photoreceptor obtained thereby; an electrophotographic photoreceptor using the substrate; and an electrophotographic device using the photoreceptor. SOLUTION: The electroplating apparatus comprises a plating part having an anode and an anode case; and suction parts for sucking sludge that spreads and settles after having slipped out from the anode case, arranged in two directions including the whole outer circumferential area around the anode case and a bottom, or two directions including the whole inner circumferential area or the bottom. The electroforming apparatus and the apparatus for manufacturing the substrate of the electrophotographic photoreceptor have the above structure therein. COPYRIGHT: (C)2006,JPO&NCIPI