ELECTROLESS COPPER PLATING METHOD OF MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method having an electroless copper plating process capable of preventing generation of voids in a wall surface of a through hole by modifying the surface of filler substance. SOLUTION: In the printed circuit board manufacturing...

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Bibliographische Detailangaben
Hauptverfasser:	TATENO JUN, SUZUKI MASAICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method having an electroless copper plating process capable of preventing generation of voids in a wall surface of a through hole by modifying the surface of filler substance. SOLUTION: In the printed circuit board manufacturing method for forming a metal conductor for interlayer connection by applying electroless plating in a through hole of a multilayer flexible printed circuit board, a conditioning step being the pretreatment is performed in two stages of a first conditioning step of immersing a work in aqueous solution mainly consisting of amine-based surfactant and a second conditioning step of immersing the work in aqueous solution mainly consisting of diols. COPYRIGHT: (C)2006,JPO&NCIPI