DIAMINE CONTAINING IMIDO GROUP, POLYIMIDE PRECURSOR CONTAINING THE IMIDE GROUP, POSITIVE TYPE PHOTOSENSITIVE RESIN CONTAINING THE PRECURSOR, MANUFACTURING METHOD OF POSITIVE TYPE PATTERN, AND ELECTRONIC PARTS

PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition capable of forming a polyimide film that excels in transparency, has fine pattern forming capability and combines a low dielectric constant and high heat resistance, and to provide a manufacturing method of a positive...

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Hauptverfasser: MASAMI HIROSHI, HASEGAWA MASATOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition capable of forming a polyimide film that excels in transparency, has fine pattern forming capability and combines a low dielectric constant and high heat resistance, and to provide a manufacturing method of a positive type pattern. SOLUTION: The positive type photosensitive resin composition contains an imido group-containing polyimide precursor represented by general formula (2), an organic solvent and a diazo naphthoquinone type sensitizer. In the formula, A indicates a tetravalent alicyclic group, R2indicates a divalent alicyclic group, and R1indicates at least one divalent organic group selected from the group consisting of aromatic groups, aliphatic groups and alicyclic groups. X indicates a molar ratio of the repeating unit and is in the range of 0.05-0.95. COPYRIGHT: (C)2006,JPO&NCIPI