BLISTER PACKAGE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a variety of blister packages for giving a user increased options for a choice of an insect-repellent collar through the use of characteristic of the blister package, and a method for capable of easily manufacturing the blister package. SOLUTION: The blister package...

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1. Verfasser: MITSUI KIYOSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a variety of blister packages for giving a user increased options for a choice of an insect-repellent collar through the use of characteristic of the blister package, and a method for capable of easily manufacturing the blister package. SOLUTION: The blister package includes the insect-repellent collar 2 molded of a first resin 10 and a second resin 11 containing an evaporative plasticizer, a blister member 4 having permeable barrier properties and light permeability and including a storage 4a for receiving the collar 2, and a seal member 3 comprising a barrier layer having the permeable barrier properties and an adhesive layer overlying a paper base in this sequence. The blister member 4 and the seal member 3 are stuck to each other with the insect-repellent collar 2 stored in the storage 4a. Decoration comprising two or more kinds of colors is applied to at least part of the collar 2. COPYRIGHT: (C)2006,JPO&NCIPI