THERMOSETTING EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition excellent in heat resistance and bending resistance at elevated temperatures while cured products of the same have improved adhesiveness. SOLUTION: The thermosetting epoxy resin composition comprises an epoxy resin (A) represen...

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Hauptverfasser:	TANO TAKAAKI, MARUYAMA HIDEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition excellent in heat resistance and bending resistance at elevated temperatures while cured products of the same have improved adhesiveness. SOLUTION: The thermosetting epoxy resin composition comprises an epoxy resin (A) represented by the formula, which is a compound obtained by reacting a glycidyl ether of a polyhydric alcohol-based glycol with a phenolic compound, as an essential ingredient, an epoxy resin (B) except the epoxy resin (A), and an acid anhydride (C) or an amine compound (D) as a curing agent. COPYRIGHT: (C)2006,JPO&NCIPI