PRINTED-WIRING BOARD AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a printed-wiring board comprising a material having a low dielectric loss tangent, a high glass-transition temperature, high flame retardance hard to increase a dielectric constant and the dielectric loss tangent in a high-humidity environment, and to provide an elec...

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Bibliographische Detailangaben
Hauptverfasser: ENDO TOSHIICHI, OKAWA HIROSHIGE, KAWABATA KENICHI, TAKATANI MINORU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a printed-wiring board comprising a material having a low dielectric loss tangent, a high glass-transition temperature, high flame retardance hard to increase a dielectric constant and the dielectric loss tangent in a high-humidity environment, and to provide an electronic component. SOLUTION: Each the printed-wiring board and the electronic component comprises an epoxy resin; a polyester comprising an aromaic multiple carboxylic residue, and an aromatic multiple hydroxy compound residue having an aryloxy carbonyl group or an aryl carbonyl oxide group at a molecular chain end; a resin layer composed of at least one of an insulating layer comprising an organic insulating material including a hardening accelerator and a flame retardant, and a dielectric layer further including dielectric powder and a surface preparation agent in the organic insulating material; and at least one conductive element provided at least one of the insulating layer and the dielectric layer of the resin layer, and constituting a capacitor element or an inductor element. COPYRIGHT: (C)2006,JPO&NCIPI