MANUFACTURING METHOD OF PRINTED WIRING BOARD WITH BUILT-IN COMPONENT

PROBLEM TO BE SOLVED: To provide a printed wiring board with built-in components which are not affected by a voluminal protruding part of a component and superior in smoothness of an inner layer core of the printed wiring board and also in electrical connection stability of it. SOLUTION: At least on...

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1. Verfasser: SUKEHIRO TOSHIYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a printed wiring board with built-in components which are not affected by a voluminal protruding part of a component and superior in smoothness of an inner layer core of the printed wiring board and also in electrical connection stability of it. SOLUTION: At least one layer of insulating base material and conductor base material are alternately laminated on both surfaces of the inner layer substrate, where a component is mounted on a component mounting pad, with the component sealed up with the insulating base material, at the same time, when laminating. A through hole of a size substantially the same as that of a mounting component is provided, in advance, on both the insulating base materials laminated on both surfaces of the inner layer substrate. COPYRIGHT: (C)2006,JPO&NCIPI