FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD
PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is perform...
Gespeichert in:
| Hauptverfasser: | , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | IKEDA KAZUTERU ISHIKAWA SHUNSUKE SHIMA TOSHINORI ANADA TAKAAKI IRIE HISAO |
| description | PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term. COPYRIGHT: (C)2006,JPO&NCIPI |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2006051532A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2006051532A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2006051532A3</originalsourceid><addsrcrecordid>eNrjZDBz8wmNUHDzD1II9vdxcQ3y9HPXQTAVfF1DPPxdFBz9XBQCgAIhri4KTv6OQS48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMDMwNTQ1NjI0ZgoRQBKdigT</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD</title><source>esp@cenet</source><creator>IKEDA KAZUTERU ; ISHIKAWA SHUNSUKE ; SHIMA TOSHINORI ; ANADA TAKAAKI ; IRIE HISAO</creator><creatorcontrib>IKEDA KAZUTERU ; ISHIKAWA SHUNSUKE ; SHIMA TOSHINORI ; ANADA TAKAAKI ; IRIE HISAO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term. COPYRIGHT: (C)2006,JPO&NCIPI</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060223&DB=EPODOC&CC=JP&NR=2006051532A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060223&DB=EPODOC&CC=JP&NR=2006051532A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IKEDA KAZUTERU</creatorcontrib><creatorcontrib>ISHIKAWA SHUNSUKE</creatorcontrib><creatorcontrib>SHIMA TOSHINORI</creatorcontrib><creatorcontrib>ANADA TAKAAKI</creatorcontrib><creatorcontrib>IRIE HISAO</creatorcontrib><title>FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD</title><description>PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term. COPYRIGHT: (C)2006,JPO&NCIPI</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBz8wmNUHDzD1II9vdxcQ3y9HPXQTAVfF1DPPxdFBz9XBQCgAIhri4KTv6OQS48DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwMDMwNTQ1NjI0ZgoRQBKdigT</recordid><startdate>20060223</startdate><enddate>20060223</enddate><creator>IKEDA KAZUTERU</creator><creator>ISHIKAWA SHUNSUKE</creator><creator>SHIMA TOSHINORI</creator><creator>ANADA TAKAAKI</creator><creator>IRIE HISAO</creator><scope>EVB</scope></search><sort><creationdate>20060223</creationdate><title>FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD</title><author>IKEDA KAZUTERU ; ISHIKAWA SHUNSUKE ; SHIMA TOSHINORI ; ANADA TAKAAKI ; IRIE HISAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2006051532A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2006</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>IKEDA KAZUTERU</creatorcontrib><creatorcontrib>ISHIKAWA SHUNSUKE</creatorcontrib><creatorcontrib>SHIMA TOSHINORI</creatorcontrib><creatorcontrib>ANADA TAKAAKI</creatorcontrib><creatorcontrib>IRIE HISAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IKEDA KAZUTERU</au><au>ISHIKAWA SHUNSUKE</au><au>SHIMA TOSHINORI</au><au>ANADA TAKAAKI</au><au>IRIE HISAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD</title><date>2006-02-23</date><risdate>2006</risdate><abstract>PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term. COPYRIGHT: (C)2006,JPO&NCIPI</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2006051532A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T21%3A02%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IKEDA%20KAZUTERU&rft.date=2006-02-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2006051532A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |