FLUX FOR SOLDERING, SOLDERING METHOD AND PRINTED BOARD

PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is perform...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	IKEDA KAZUTERU, ISHIKAWA SHUNSUKE, SHIMA TOSHINORI, ANADA TAKAAKI, IRIE HISAO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flux for soldering in which the preservation stability of the flux is increased, a soldering method using the same and a printed board. SOLUTION: The flux contains a resin having film forming ability, an activator and a solvent and is used when soldering is performed on the printed board to which electroless nickel plating is applied. The flux contains organic acid metallic salt of 0.1-20 wt.% to the total amount of the flux and, the activator is the same organic acid as an organic acid which comprises the organic acid metallic salt or an organic acid which is lower than it in acidity. Thus, the stability of the organic acid metallic salt is increased and high joining strength is maintained for a long term. COPYRIGHT: (C)2006,JPO&NCIPI