DIE BONDER

PROBLEM TO BE SOLVED: To provide a die bonder capable of enhancing bonding accuracy. SOLUTION: Coordinate on a monitor screen 51 of a chip 4 moved in the X direction is stored as X moving time monitor coordinate (Xp1, Yp1), and coordinate on an XY table is stored as X moving time table coordinate (X...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	FUJII TOSHIHEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL PHYSICS SEMICONDUCTOR DEVICES
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