DIE BONDER

DIE BONDER

PROBLEM TO BE SOLVED: To provide a die bonder capable of enhancing bonding accuracy. SOLUTION: Coordinate on a monitor screen 51 of a chip 4 moved in the X direction is stored as X moving time monitor coordinate (Xp1, Yp1), and coordinate on an XY table is stored as X moving time table coordinate (X...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: FUJII TOSHIHEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a die bonder capable of enhancing bonding accuracy. SOLUTION: Coordinate on a monitor screen 51 of a chip 4 moved in the X direction is stored as X moving time monitor coordinate (Xp1, Yp1), and coordinate on an XY table is stored as X moving time table coordinate (Xt1, Yt1). An X coordinate value (Xt0) is subtracted from the X coordinate value (Xt1) and absolute value of the difference is taken. The subtracted value is divided by the absolute value of difference between the X coordinate value (Xp1) and an X coordinate value (Xp0) thus calculating an X direction magnification coefficient MAGNIX. Similar processing is also performed in the Y direction and a Y direction magnification coefficient MAGNIY is calculated. The chip 4 is moved by driving the XY table with a value obtained by using the X direction magnification coefficient MAGNIX and the Y direction magnification coefficient MAGNIY, and a slippage produced on this occasion is reflected on the X direction magnification coefficient MAGNIX and the Y direction magnification coefficient MAGNIY. COPYRIGHT: (C)2006,JPO&NCIPI