SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein signal time delay is suppressed by connecting the semiconductor chips by short wire length, so that impairment of performance of a mounted semiconductor chip and increase in chip-loading substrate area of the semiconductor device can be restrained. SOLUTION: Each memory chip 102 is provided with a plurality of pads 11 for chip wiring which interface signal wiring for output and input in common between memory chips. In each memory chip 102, the pads 11 for chip wiring and a plurality of pads which are used for inputting required signals in order to operate the memory chip are wired and connected by arbitrary wiring layers. The memory chips 102 are connected in series with external wiring by using the pads, so that common signal wiring is reduced. As a result, even if the number of semiconductor chips mounted on the semiconductor device is increased, signal time delay is suppressed by connecting the semiconductor chips by short wire length, and impairment of performance of a mounted semiconductor chip and increase in chip loading substrate area of the semiconductor device can be restrained. COPYRIGHT: (C)2006,JPO&NCIPI