METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate which can elongate the number of times of using a buffer member and can improve an operating rate. SOLUTION: The method of manufacturing the multilayer substrate 100 includes a laminating step of laminating a resin fil...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate which can elongate the number of times of using a buffer member and can improve an operating rate. SOLUTION: The method of manufacturing the multilayer substrate 100 includes a laminating step of laminating a resin film 11 made of a thermoplastic resin and a conductor pattern 12 to form a laminate 20; and a heating and pressurizing step of heating and pressurizing the laminate 20 by a hot press plate 50 from both upper and lower surfaces, in the state that the buffer member 50 arranged between the laminate 20 and the hot press plate 50 for reducing the pressure difference to be applied to the respective parts of the laminate 20 from the hot press plate 50 is interposed between the front surface of the laminate 20 and the hot press plate 50. The individual buffer members 60 are prepared according to the disposition of the conductor pattern 12 to the resin film 11. In the heating and pressurizing step, in the state that the laminate 20 and the buffer member 60 corresponding to the conductor pattern 12 of the laminate 20 are positioned, the laminate 20 is heated and pressurized by the hot press plate 50. COPYRIGHT: (C)2006,JPO&NCIPI |
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