ALIGNER AND METHOD FOR MANUFACTURING LAYERED SUBSTRATE

PROBLEM TO BE SOLVED: To provide an aligner which can control a patterning dimension of a layered substrate having a plurality of layers formed on a substrate by exposure to be within a specified range, and to provide a method for manufacturing a layered substrate. SOLUTION: In the manufacturing pro...

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Hauptverfasser: SAITO KAORI, KITO TSUNANORI, TAGUSA YASUNOBU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an aligner which can control a patterning dimension of a layered substrate having a plurality of layers formed on a substrate by exposure to be within a specified range, and to provide a method for manufacturing a layered substrate. SOLUTION: In the manufacturing process of a TFT substrate, an exposure magnification for a first layer is determined, and a pattern for the first layer is transferred by exposure based on the determined exposure magnification. In the steps of transferring patterns for the second and succeeding layers, the exposure magnification is corrected based on the extraction and contraction amount of the substrate. When the lamination accuracy between a completed TFT substrate and a CF substrate is out of a predetermined range, a magnification correction value for the first layer to retain the lamination accuracy within the predetermined is calculated, and the consecutive TFT substrate is manufactured based on the calculated magnification correction value. COPYRIGHT: (C)2006,JPO&NCIPI