MOUNT HEAD

PROBLEM TO BE SOLVED: To provide a mount head of a ball mounting device securing parallelism of a workpiece and a vacuum plate and exactly mounting a large quantity of solder balls on the workpiece by making the vacuum plate copy a workpiece surface. SOLUTION: This mount head for the ball mounting d...

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Bibliographische Detailangaben
1. Verfasser:	KOBAYASHI TATSUHARU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MANIPULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mount head of a ball mounting device securing parallelism of a workpiece and a vacuum plate and exactly mounting a large quantity of solder balls on the workpiece by making the vacuum plate copy a workpiece surface. SOLUTION: This mount head for the ball mounting device mounts the ball on the workpiece by generating vacuum pressure in many suction holes of the vacuum plate provided on a lower surface of the mount head, sucks the ball, and moves the mount head to a ball mount position, as a means for securing parallelism of the workpiece and the vacuum plate. The mount head is provided with: the thin vacuum plate opened with many suction holes to suck the ball and copying the workpiece surface at the time of mounting the ball; and a supporting plate for supporting the vacuum plate from external force. COPYRIGHT: (C)2006,JPO&NCIPI