CERAMIC CIRCUIT BOARD AND ELECTRIC APPARATUS

PROBLEM TO BE SOLVED: To provide a ceramic circuit board which can improve the thermal shock of the ceramic board with a metallic circuit or durability over a heat history, namely, heat shock-proof characteristics or heat cycle-proof characteristics, and to provide an electric apparatus. SOLUTION: I...

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Hauptverfasser:	YOSHIHARA YASUHIKO, TERASONO HIROBUMI, TERAO SHINYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramic circuit board which can improve the thermal shock of the ceramic board with a metallic circuit or durability over a heat history, namely, heat shock-proof characteristics or heat cycle-proof characteristics, and to provide an electric apparatus. SOLUTION: In a ceramic circuit board 11 which carries out the pasting formation of a metal plate 23 to both the principal surfaces of a ceramic substrate 21, the side edge 25 of the ceramic substrate 21 is formed inside the side edge 27 of the metal plate 23. COPYRIGHT: (C)2006,JPO&NCIPI